CEAC Solder Alloys are produced to yield
high-purity, low-oxygen, spherical metal powders.
reliability, over long periods of time, are guaranteed by the accurate
compositions of CEAC's solder alloys.
The choice of the alloy depends primarily on the properties of the base
metal. The selection of the solder alloy is also dependent on the method
of application. Factors such as melting point, plastic range, speed of
wetting, ability to wet, flow and bond to different metals and also
appearance after soldering must be considered when selecting the proper
Our standard and custom formulations are increasingly in demand.
CEAC can satisfy all customer requirements.
This the largest single group and the most widely used of the
soldering alloys. Most metals can be joined with these alloys ideally
with clearances of 0.003 to 0.0005 in. Tin-lead solders are compatible
with all types of base-metal cleaners, fluxes, and heating methods.
Increasing the tin content of these solders produces better wetting and
flow characteristics. Thus, when less tin is used, greater care should
be exercised in surface preparation of the metals to be joined.